Method of manufacturing semiconductor device and semiconductor device

ABSTRACT

To enhance reliability of a test by suppressing defective bonding of a solder in the test of a semiconductor device, a method of manufacturing the semiconductor device includes: preparing a semiconductor wafer that includes a first pad electrode provided with a first cap film and a second pad electrode provided with a second cap film. Further, a polyimide layer that includes a first opening on the first pad electrode and a second opening on the second pad electrode is formed, and then, a rearrangement wiring that is connected to the second pad electrode via the second opening is formed. Next, an opening is formed in the polyimide layer such that an organic reaction layer remains on each of the first pad electrode and a bump land of the rearrangement wiring, then heat processing is performed on the semiconductor wafer, and then, a bump is formed on the rearrangement wiring.

CROSS-REFERENCE TO RELATED APPLICATION

The present application is a continuation of U.S. patent applicationSer. No. 15/245,700 filed Aug. 24, 2016, which claims priority fromJapanese Patent Application No. 2015-168248 filed on Aug. 27, 2015, thecontents of which are hereby incorporated by reference into thisapplication.

TECHNICAL FIELD OF THE INVENTION

The present invention relates to technique of manufacturing asemiconductor device, for example, technique for a wafer process packageand so forth, and to a semiconductor device.

BACKGROUND OF THE INVENTION

In a wafer process package (WPP, or referred to also as a wafer levelpackage (WLP)), a solder bump is bonded to each terminating end of aplurality of rearrangement wirings (rewirings).

There is a description in, for example, Japanese Patent ApplicationLaid-Open No. 2009-246218 (Patent Document 1) regarding a structure andassembly of the wafer process package. Patent Document 1 disclosestechnique in which a probe needle is brought into contact with anelectrode of a wafer process package.

SUMMARY OF THE INVENTION

In the above-described wafer process package, there is a step of testinga non-volatile memory during an assembly process when the non-volatilememory is incorporated in a semiconductor chip. This testing stepincludes a heat processing step, which is called a retention bakingstep, in which data is programmed in the non-volatile memory, and then,a thermal load is applied at 250° C. for about 72 hours, for example.Further, it is checked whether there is a loss in the data programmed inthe memory after the retention baking step.

Here, when the rearrangement wiring is formed after the step of testingthe memory, for example, there is a possibility that the data programmedin the memory is lost in the heat processing at high temperature whichis implemented at the time of forming the rearrangement wiring.Accordingly, it is preferable to perform the step of testing thenon-volatile memory after forming the rearrangement wiring in order toprevent the loss in the data programmed in the memory.

In this case, the memory test is performed by bringing the probe intocontact with a pad of the rearrangement wiring in the above-describedstep of testing the non-volatile memory, but accuracy of the testdecreases since a Ni (nickel) layer formed on a surface of a Cu (copper)layer of the rearrangement wiring is hard and a contact resistance withthe probe is large. At this time, it is considered to perform Au platingon the pad of the rearrangement wiring in order to achieve acountermeasure against the contact resistance of the probe and to securethe wettability of the solder bump, which causes Ni to spring up and beoxidized on an Au (gold)-plated film due to the retention baking, and asa result, leads to an increase of the contact resistance of the probeand defective wettability and defective bonding of the solder.

Other problems and novel features will become apparent from thedescription of the specification and the attached drawings.

In a method of manufacturing a semiconductor device of an embodiment ofthe present invention, a semiconductor substrate is prepared, thesemiconductor substrate including a first pad electrode and a second padelectrode, the first pad electrode being formed at an uppermost layer ofa plurality of wiring layers and having a first metal film formed on asurface of the first pad electrode, and the second pad electrode beingelectrically connected to the first pad electrode, being formed at theuppermost layer of the plurality of wiring layers and having a secondmetal film formed on a surface of the second pad electrode. Further, afirst insulating film is formed having a first opening for exposing thefirst metal film of the first pad electrode, and a second opening forexposing the second metal film in the second pad electrode. A wiringwhich is electrically connected to the second pad electrode via thesecond opening is formed. Further, a third opening is formed in a secondinsulating film above the first pad electrode and a fourth opening ofthe second insulating film above the wiring is formed while leaving anorganic reaction layer on each surface of the first pad electrode andthe wiring. Still further, after forming the fourth opening, heatprocessing is performed on the semiconductor substrate, and then a bumpis formed in the fourth opening on the wiring.

A semiconductor device of an embodiment includes: a semiconductor chiphaving a main surface in which a semiconductor circuit is formed; aplurality of first pad electrodes electrically connected to thesemiconductor circuit and are exposed at the main surface; a pluralityof second pad electrodes electrically connected to the plurality offirst pad electrodes, respectively, and formed on the same layer witheach of the plurality of first pad electrodes; and a plurality ofwirings covering each of the plurality of second pad electrodes and areelectrically connected to the plurality of second pad electrodes,respectively. Further, the semiconductor device includes an insulatingfilm formed on the plurality of wirings; and a plurality of bumpsprovided in opening port ions of the insulating films of the pluralityof wirings. Each surface of the plurality of first pad electrodes isexposed.

According to the embodiment described above, in a test of asemiconductor device, reliability of the test can be improved withsuppressing a defective solder joint.

BRIEF DESCRIPTIONS OF THE DRAWINGS

FIG. 1 is a partial plan view transparently illustrating an example ofan internal structure of the main part of the semiconductor deviceaccording to an embodiment;

FIG. 2 is a cross-sectional view illustrating a structure taken along aline A-A illustrated in FIG. 1;

FIG. 3 is an enlarged partial cross-sectional view illustrating anexample of the internal structure of the main part of the semiconductordevice illustrated in FIG. 1;

FIG. 4 is an enlarged partial plan view illustrating an example of astructure of a pad of the main part illustrating the semiconductordevice illustrated in FIG. 1;

FIG. 5 is a plan view illustrating each example of a pad array and arewiring of the main part of the semiconductor device illustrated inFIG. 1;

FIG. 6 is an enlarged partial plan view and an enlarged partialcross-sectional view illustrating an example of a structure of a part Aof FIG. 5;

FIG. 7 is an enlarged partial plan view and an enlarged partialcross-sectional view illustrating an example of a structure of a part Bof FIG. 5;

FIG. 8 is a flow chart with a cross-sectional view illustrating a partof a manufacturing method of the semiconductor device of FIG. 1;

FIG. 9 is a flow chart with a cross-sectional view illustrating a partof the manufacturing method of the semiconductor device of FIG. 1;

FIG. 10 is a flow chart with a cross-sectional view illustrating a partof the manufacturing method of the semiconductor device of FIG. 1;

FIG. 11 is a flow chart with a cross-sectional view illustrating a partof the manufacturing method of the semiconductor device of FIG. 1;

FIG. 12 is a flow chart with a cross-sectional view illustrating a partof the manufacturing method of the semiconductor device of FIG. 1;

FIG. 13 is a data diagram illustrating a relationship of a thickness ofan oxide film and an organic reaction layer in the method ofmanufacturing the semiconductor device;

FIG. 14 is an enlarged partial plan view illustrating a structure of amodification example of the embodiment;

FIG. 15 is a partial cross-sectional view illustrating a structure takenalong a line A-A illustrated in FIG. 14; and

FIG. 16 is a cross-sectional view illustrating a structure of asemiconductor device to which the modification example of the embodimentis applied.

DESCRIPTIONS OF THE PREFERRED EMBODIMENTS

In an embodiment described hereinafter, repetitive descriptions of thesame or similar components will be omitted.

In the embodiments described below, the invention will be described in aplurality of sections or embodiments when required as a matter ofconvenience. However, these sections or embodiments are not irrelevantto each other unless otherwise stated, and the one relates to the entireor a part of the other as a modification example, details, or asupplementary explanation thereof.

Also, in the embodiments described below, when referring to the numberof elements (including number of pieces, values, amount, range, and thelike), the number of the elements is not limited to a specific numberunless otherwise stated or except the case where the number isapparently limited to a specific number in principle. The number largeror smaller than the specified number is also applicable.

Further, in the embodiments described below, it goes without saying thatthe components (including element steps) are not always indispensableunless otherwise stated or except the case where the components areapparently indispensable in principle.

Further, it is needless to say that such phrases as “formed of A”, “madeof A”, “comprising A”, “including A”, “having A” do not eliminate otherelements than A unless otherwise stated that the element is limited tothat. Similarly, in the embodiments described below, when the shape ofthe components, positional relation thereof, and the like are mentioned,the substantially approximate and similar shapes and the like areincluded therein unless otherwise stated or except the case where it isconceivable that they are apparently excluded in principle. The samegoes for the numerical value and the range described above.

Hereinafter, the embodiment of the present invention will be describedin detail based on the accompanying drawings. Note that, in all of thedrawings for describing the embodiments, identical members are providedwith the same reference character in principle, and are not repetitivelydescribed. Note that even a plan view may be hatched in order to makethe drawing easily understood.

<Structure of Semiconductor Device>

FIG. 1 is a partial plan view transparently illustrating an example ofan internal structure of the main part of the semiconductor deviceaccording to an embodiment; FIG. 2 is a cross-sectional viewillustrating a structure taken along a line A-A illustrated in FIG. 1;FIG. 3 is an enlarged partial cross-sectional view illustrating anexample of the internal structure of the main part of the semiconductordevice illustrated in FIG. 1; and FIG. 4 is an enlarged partial planview illustrating an example of a structure of a pad of the main partillustrating the semiconductor device illustrated in FIG. 1. Inaddition, FIG. 5 is a plan view illustrating each example of a pad arrayand a rewiring of the main part of the semiconductor device illustratedin FIG. 1; FIG. 6 is an enlarged partial plan view and an enlargedpartial cross-sectional view illustrating an example of a structure of apart A of FIG. 5; and FIG. 7 is an enlarged partial plan view and anenlarged partial cross-sectional view illustrating an example of astructure of a part B of FIG. 5.

A semiconductor device according to the present embodiment illustratedin FIG. 1 is a wafer process package 5, and a small semiconductorpackage which is substantially equal to a size of a chip.

A description will be given regarding a configuration of the waferprocess package 5 according to the present embodiment with reference toFIGS. 1 and 2. The wafer process package 5 includes a semiconductor chip2 having a main surface 2 b, in which a semiconductor circuit is formedon the main surface 2 b, a plurality of first pad electrodes 2 aa whichare electrically connected to the semiconductor circuit and exposed atthe main surface 2 b, and a plurality of second pad electrodes 2 abwhich are electrically connected to each of the plurality of first padelectrodes 2 aa, and formed on the same layer with each of the pluralityof first pad electrodes 2 aa.

That is, a plurality of pad electrodes 2 a are provided side by side intwo columns, and there are those which are arranged side by side at theouter side are the plurality of first pad electrodes 2 aa while thereare those which are arranged side by side at the inner side are theplurality of second pad electrodes 2 ab as illustrated in FIG. 1.

Further, rearrangement wirings (wirings) 2 e are connected to each ofthe plurality of second pad electrodes 2 ab. The rearrangement wiring 2e is provided for rearranging each position of the plurality of secondpad electrodes 2 ab to a different position, and is also called therewiring.

In other words, each of the plurality of first pad electrodes 2 aa isarranged side by side on an end portion side (peripheral edge portionside) of the main surface 2 b of the semiconductor chip 2, and each ofthe plurality of second pad electrodes 2 ab is arranged at the innerside than each of the plurality of first pad electrodes 2 aa. Further,the rearrangement wiring 2 e is led out from each of the plurality ofsecond pad electrodes 2 ab arranged at the inner side.

Specifically, the rearrangement wiring 2 e covers each of the pluralityof second pad electrodes 2 ab, and further, is electrically connected toeach of the plurality of second pad electrodes 2 ab as illustrated inFIG. 2. Further, bump lands 2 ac are formed at end portions on theopposite side of the second pad electrodes 2 ab of the rearrangementwirings 2 e, and each of a solder bump (bump) 3 is mounted to each ofthe bump lands 2 ac as an external terminal of the wafer process package5.

Specifically, a polyimide layer 2 f serving as an insulating film isformed on each of the plurality of rearrangement wirings 2 e, further,the bump land 2 ac is formed in an opening portion 2 m of the polyimidelayer 2 f on each of the plurality of rearrangement wirings 2 e, and thesolder bump 3 is provided on each of the bump lands 2 ac.

Incidentally, each surface of the plurality of first pad electrodes 2 aaarranged at the outer side is exposed. Specifically, a first cap film(first metal film) 2 r is formed on each surface of the first padelectrodes 2 aa, and further, an organic reaction layer 2 ka is foistedon the first cap film 2 r as illustrated in FIG. 2. In addition, thefirst cap film 2 r extends on each of the plurality of second padelectrodes 2 ab.

Specifically, the first cap film 2 r is formed on a surface of an Al(aluminum) pad 2 s in the first pad electrode 2 aa, and further, theorganic reaction layer 2 ka, which is an organic thin film, is formed onthe surface of the first cap film 2 r as illustrated in FIG. 2. Further,the Al pad 2 s of the first pad electrode 2 aa is linked with the Al pad2 s of the second pad electrode 2 ab. That is, the Al pad 2 s of thefirst pad electrode 2 aa and the Al pad 2 s of the second pad electrode2 ab are integrally formed. In other words, the Al pad 2 s according tothe present embodiment is considered also as the Al pad 2 s equippedwith a cap film.

Further, a second cap film (second metal film) 2 t is also formed on asurface of the Al pad 2 s in a region of the second pad electrode 2 ab.That is, the first cap film 2 r and the second cap film 2 t are alsointegrally formed on the Al pad 2 s.

Further, the rearrangement wiring 2 e is connected to the second padelectrode 2 ab.

Incidentally, the first cap film 2 r and the second cap film 2 t aremade of, for example, TiN (titanium nitride). Accordingly, the first capfilm 2 r made of TiN is exposed to the first pad electrode 2 aa.

In addition, the rearrangement wiring 2 e has, for example, athree-layer structure, and includes, for example, a seed layer 2 hb madeof a Cu (copper) film, a Cu layer 2 i, and a Ni (nickel) layer 2 n froma lower layer side toward an upper layer side.

In addition, a plurality of wiring layers 2 u are formed below the firstpad electrodes 2 aa, a wiring M of each layer is electrically connectedvia a plug 2 w as illustrated in FIG. 3. Further, memory cells 2 v areformed on both sides of the plug 2 w serving as a drain at the lowermostlayer of the wiring layer 2 u. The memory cell 2 v is, for example, anon-volatile memory (flash memory), and the semiconductor circuitincluding the non-volatile memory circuit is formed in the semiconductorchip 2 according to the present embodiment.

In addition, FIG. 4 is the plan view of each of the first pad electrode2 aa and the second pad electrode 2 ab, and a first opening 2 ja, whichis an opening portion of the first pad electrode 2 aa, has a size farlarger than that of a second opening 2 jb which is an opening portion ofthe second pad electrode 2 ab (Y>X). This is because the first padelectrode 2 aa is a pad for a probe test or wire bonding while thesecond pad electrode 2 ab is a pad for rearrangement wiring connection,which will be described later.

It is possible to easily change each size of these pads by adjusting asize of an opening portion of an insulating film formed in the pad.

Next, a description will be given regarding a structure of the pad ofthe semiconductor chip to be mounted to the wafer process package 5according to the present embodiment.

The semiconductor chip 2 illustrated in FIG. 5 has a structure beforeattaching the solder bump 3 that is illustrated in FIG. 2 thereto.

The pad electrodes 2 a are provided in two columns on the main surface 2b of the semiconductor chip 2 along the peripheral edge portion thereof.Further, the rearrangement wirings 2 e are provided on each of thesecond pad electrodes 2 ab in the column at the inner side among the padelectrodes 2 a arranged in two columns, and each of the plurality ofrearrangement wirings 2 e is led out toward the inside of the mainsurface 2 b. Further, the bump lands 2 ac are formed at the respectiveend portions of the rearrangement wirings 2 e.

Incidentally, the respective bump lands 2 ac are provided side by sideat an equal pitch both in the X direction and in the Y direction on themain surface 2 b. That is, the plurality of bump lands 2 ac are providedside by side in a lattice style on the main surface 2 b.

Accordingly, the plurality of solder bumps 3 are also arranged in alattice style when the solder bumps 3 are mounted to each of theplurality of bump lands 2 ac.

FIG. 6 illustrates the plan view and the cross-sectional view of thefirst pad electrode 2 aa and the second pad electrode 2 ab. The firstpad electrode 2 aa and the second pad electrode 2 ab according to thepresent embodiment are configured such that the insulating film isinterposed in the Al pad 2 s having an elongated rectangular planarshape, and two openings are formed in the insulating film. Accordingly,the integrally formed Al pad 2 s is divided into two electrode regionsand used with the first pad electrode 2 aa and the second pad electrode2 ab.

Accordingly, the Al pad 2 s is formed to be integrally linked from thefirst pad electrode 2 aa over the second pad electrode 2 ab, andfurther, the first cap film 2 r and the second cap film 2 t, which areintegrally formed, are arranged on the Al pad 2 s. That is, the Al pad 2s is the Al pad 2 s equipped with the cap film. Incidentally, the firstcap film 2 r and the second cap film 2 t are made of, for example, TiN(titanium nitride).

Further, the organic reaction layer 2 ka, which is extremely thin havinga thickness of, for example, about several hundred nm (nano meters), isformed on the surface of the first cap film 2 r of the first padelectrode 2 aa.

In addition, the plurality of wiring layers 2 u are formed below thefirst pad electrode 2 aa, and further, the memory cells 2 v are formedat the lowermost layer thereof as illustrated in FIG. 3, and the memorycell 2 v is, for example, the non-volatile memory (flash memory) asdescribed above.

In addition, the bump land 2 ac is formed at the end portion of therearrangement wiring 2 e led out from the second pad electrode 2 ab asillustrated in FIG. 7. An organic reaction layer 2 kb, which is anorganic thin film, is formed on a surface of the Ni layer 2 n at theuppermost layer of the bump land 2 ac illustrated in FIG. 2 beforemounting the solder bump 3 d.

Incidentally, the organic reaction layer 2 kb formed on the surface ofthe bump land 2 ac is removed by, for example, ashing at the time ofmounting the solder bump 3 to the bump land 2 ac. Accordingly, it ispossible to cause the bump land 2 ac to be wetted with the solder bump3, and to cause the solder bump 3 to be favorably connected with thebump land 2 ac.

In the wafer process package 5 according to the present embodiment, thefirst pad electrodes 2 aa, which are at the outer side (end portionside) among the plurality of pad electrodes 2 a arranged in two columnson the peripheral edge portion of the main surface 2 b of thesemiconductor chip 2, remain without any change, and the second padelectrodes 2 ab in the inner-side column are connected with therearrangement wirings 2 e.

Accordingly, the plurality of first pad electrodes 2 aa, which aredifferent from the electrode for mounting of the bump, are provided atthe peripheral edge portion (end portion) of the main surface 2 b sothat it is possible to implement the probe test using the first padelectrodes 2 aa even after the solder bump are mounted. That is, it ispossible to perform the probe test by bringing a probe in contact withthe first pad electrode 2 aa without bringing the probe in contact withthe solder bump 3 even after the wafer process package 5 is assembled.

Incidentally, the first pad electrode 2 aa and the second pad electrode2 ab may be formed by dividedly providing the two openings of theinsulating film may be formed at the upper layer of the single elongatedAl pad 2 s as in the present embodiment, or by forming different Al pads2 s in advance and forming the first pad electrode 2 aa and the secondpad electrode 2 ab to the Al pads 2 s, respectively.

<Method of Manufacturing Semiconductor Device>

Next, a description will be given regarding a method of manufacturingthe semiconductor device according to the present embodiment. Each ofFIGS. 8 to 12 is a flow chart with a cross-sectional view illustrating apart of the method of manufacturing the semiconductor device of FIG. 1.

First, pad opening (leaving a cap) illustrated in FIG. 8 is performed.In the above-described pad opening, a semiconductor wafer (semiconductorsubstrate) 1, which includes the plurality of semiconductor chips 2 eachof which has a first region 2 x and a second region 2 y different fromthe first region 2 x formed therein, is prepared. Incidentally, theplurality of wiring layers 2 u, the first pad electrode 2 aa providedwith the first cap film 2 r formed at the uppermost layer of theplurality of wiring layers 2 u in the first region 2 x, and the secondpad electrode 2 ab provided with the second cap film 2 t formed at theuppermost layer of the plurality of wiring layers 2 u in the secondregion 2 y, which are illustrated in FIG. 3, are formed in each regionof the semiconductor chips 2 of the semiconductor wafer 1.

Further, the Al pad 2 s, which is formed in an integrally linked manner,is formed with respect to the first pad electrode 2 aa and the secondpad electrode 2 ab. Specifically, the insulating film is interposed inthe Al pad 2 s having the elongated rectangular planar shape, the twoopenings are formed in the insulating film, and the integrally formed Alpad 2 s is divided into the two electrode regions and used with thefirst pad electrode 2 aa and the second pad electrode 2 ab.

That is, the opening for the first pad electrode 2 aa and the openingfor the second pad electrode 2 ab are formed in a protective film 2 zserving as the insulating film and formed on the elongated Al pad 2 ssuch that the first cap film 2 r and the second cap film 2 t remain.Incidentally, the first cap film 2 r and the second cap film 2 t, whichare integrally formed, are arranged on the Al pad 2 s. That is, the Alpad 2 s is the Al pad 2 s equipped with the cap film. Here, the firstcap film 2 r and the second cap film 2 t are made of, for example, TiN.

In addition, the plurality of wiring layers 2 u are formed below thefirst pad electrode 2 aa, and further, the memory cells 2 v are formedat the lowermost layer thereof as illustrated in FIG. 3, and the memorycell 2 v is, for example, a non-volatile memory (flash memory).

Next, polyimide layer patterning illustrated in FIG. 8 is performed. Inthis polyimide layer patterning, a polyimide layer 2 d is formed on theprotective film 2 z on a main surface 1 a of the semiconductor wafer 1,and thereafter, each upper surface of the first pad electrode 2 aa andthe second pad electrode 2 ab is opened by patterning. In other words,the polyimide layer (first insulating film) 2 d, which includes thefirst opening 2 ja causing the first cap film 2 r to be exposed on thefirst pad electrode 2 aa, and the second opening 2 jb causing the secondcap film 2 t to be exposed on the second pad electrode 2 ab, is formed.

At this time, a size of the first opening 2 ja when viewed in a planview is larger than a size of the second opening 2 jb when viewed in aplan view as illustrated in FIG. 4. That is, the first pad electrode 2aa is the pad for the probe test or the wire bonding, and the second padelectrode 2 ab is the pad for connection of the rearrangement wiring 2e. Accordingly, the relationship is like the first opening 2 ja>thesecond opening 2 jb. Incidentally, it is possible to easily change eachsize of these pads by adjusting each size of the opening portions of theinsulating film (polyimide layer 2 d) formed on the pads.

Ashing illustrated in FIG. 8 is performed after the above-describedpolyimide layer patterning. In the above-described ashing, an organicfilm (the organic reaction layer), formed on the surface of the secondcap film 2 t of the second pad electrode 2 ab, is removed by the ashing.

Seed layer sputtering illustrated in FIG. 8 is performed after theabove-described ashing. In this seed layer sputtering, the seed layer 2hb is formed (deposited) on the polyimide layer 2 d, the first padelectrode 2 aa, and the second pad electrode 2 ab by sputtering.Accordingly, each of the first pad electrode 2 aa and the second padelectrode 2 ab is electrically connected to the seed layer 2 hb. First,a Cr (chromium) film 2 ha is formed as a barrier layer (conductivelayer), and a Cu film 2 hb is formed on the Cr film 2 ha as the seedlayer. In addition, the barrier layer (conductive layer) may be theabove-described Cr film 2 ha or a film made of titanium (TiN), and afilm made of a different material from those of the first cap film 2 rand the second cap film 2 t is used.

Resist patterning illustrated in FIG. 9 is performed after theabove-described seed layer sputtering. In this resist patterning, theentire region is covered by a resist 2 g except for a portion of therearrangement wiring 2 e to be formed in the subsequent step.Specifically, the resist 2 g serving as a mask layer that covers thefirst opening 2 ja and causes the second opening 2 jb to be exposed isformed on the polyimide layer (first insulating film) 2 d with the seedlayer 2 hb interposed therebetween. That is, an upper surface of thefirst opening 2 ja of the first pad electrode 2 aa is covered by theresist 2 g, and further the second opening 2 jb is exposed withoutcovering an upper surface of the second opening 2 jb of the second padelectrode 2 ab with the resist 2 g.

Rearrangement wiring-Cu/Ni electroplating formation, illustrated in FIG.9, is performed after the above-described resist patterning. In thisrearrangement wiring-Cu/Ni electroplating formation, the rearrangementwiring (wiring) 2 e, which is electrically connected to the second padelectrode 2 ab and mainly contains Cu, is formed via the second opening2 jb. First, electroplating formation of Cu is performed, andthereafter, electroplating formation of Ni is performed upon theformation of the rearrangement wiring 2 e.

Specifically, first, the Cu layer 2 i is formed on the seed layer 2 hbinside a region surrounded by the resist (mask layer) 2 g byelectroplating. In this manner, the rearrangement wiring 2 e (the Culayer 2 i) containing Cu as the main component is formed on the seedlayer 2 hb. Thereafter, the Ni layer 2 n is formed on the surface of therearrangement wiring 2 e by electroplating. In this manner, the seedlayer 2 hb, the rearrangement wiring 2 e (the Cu layer 2 i), and the Nilayer 2 n are formed.

As a result, the rearrangement wiring 2 e is formed to the second padelectrode 2 ab, but is not formed to the first pad electrode 2 aa.

Resist removing and wet etching illustrated in FIG. 10 are performedafter the above-described rearrangement wiring-Cu/Ni electroplatingformation. In this resist removing and wet etching, the resist 2 g thatsurrounds the rearrangement wiring 2 e is removed, and further, the seedlayer 2 hb and the Cr film 2 ha on the first pad electrode 2 aa (belowthe resist 2 g) are removed.

That is, the resist 2 g serving as the mask layer is removed to exposethe first opening 2 ja, and further, the Cu film (seed layer) 2 hb andthe Cr film (conductive layer) on the first cap film 2 r are removed bywet etching such that the first cap film 2 r of the first pad electrode2 aa remains.

At this time, the barrier layer is the Cr film 2 ha, and the first capfilm 2 r is the TiN film, and thus, the first cap film 2 r remains onthe Al pad 2 s without being removed even when the Cr film 2 ha isremoved by the wet etching. That is, the Al pad 2 s is kept in the stateof being covered by the first cap film 2 r.

Accordingly, it is possible to prevent the Al pad 2 s from corrosion.

Polyimide layer patterning illustrated in FIG. 10 is performed after theabove-described resist removing and wet etching. In this polyimide layerpatterning, first, the polyimide layer (second insulating film) 2 f isformed on the rearrangement wiring 2 e and on the first pad electrode 2aa. Further, an upper part of the end portion of the rearrangementwiring 2 e and the upper surface of the first pad electrode 2 aa areopened by patterning.

Specifically, a third opening 2 ma is formed above the first padelectrode 2 aa of the polyimide layer 2 f such that the organic reactionlayer 2 ka remains on the surface of the first pad electrode 2 aa, and afourth opening 2 mb is formed at an end portion (bump land 2 ac) of thepolyimide layer 2 f such that the organic reaction layer 2 kb remains onthe surface of the end portion (bump land 2 ac) of the rearrangementwiring 2 e. That is, the organic reaction layer 2 ka is formed on thesurface of the first pad electrode 2 aa, and further, the organicreaction layer 2 kb is formed on the surface of the bump land 2 ac bynot performing the ashing. Incidentally, it is possible to form theorganic reaction layers 2 ka and 2 kb having the anticorrosive effect inthe case of only opening the polyimide layer. Accordingly, the Ni layer2 n of the bump land 2 ac is not substantially oxidized, and this effectis maintained as long as the asking is not performed. Each thickness ofthe organic reaction layer 2 ka and the organic reaction layer 2 kb,which are formed at this time, is about 100 nm, for example.

In the above-described manner, the organic reaction layer 2 ka is formedon a surface of the third opening 2 ma of the first pad electrode 2 aa,and the organic reaction layer 2 kb is formed on a surface of the fourthopening 2 mb in the bump land 2 ac of the end portion of therearrangement wiring 2 e.

Accordingly, the first cap film 2 r on the Al pad 2 s is not exposed inthe third opening 2 ma of the first pad electrode 2 aa, nor is the Nilayer 2 n of the rearrangement wiring 2 e exposed in the fourth opening2 mb of the bump land 2 ac of the rearrangement wiring 2 e.

Further, it is possible to prevent the surface of the bump land 2 acfrom oxidation using the organic reaction layer 2 kb in the presentembodiment, and thus, Au (gold) plating formation (immersion gold) isnot performed on the surface of the bump land 2 ac.

Here, a description will be given regarding whether the plated film isformed depending on presence or absence of the organic reaction layerwith reference to FIG. 13. FIG. 13 is a data diagram illustrating arelation between a thickness of an oxide film and the organic reactionlayer in the method of manufacturing the semiconductor device of FIG. 1,and illustrates a ratio of the oxide film thickness on the basis of aninitial stage of the heat processing for a memory test and a stage afterthe processing, and further, on the basis of “presence” and “absence” ofthe organic reaction layer. Incidentally, the vertical axis in FIG. 13uses a maximum oxide film thickness (thickness of a Ni oxide film),which enables the Au plating to be formed, as Reference 1, and FIG. 13illustrates that the Au plating can be formed in a range under or equalto Reference 1.

According to the oxide film thickness ratios of FIG. 13, a ratio is 0.5below Reference 1 when the organic reaction layer is present after theheat processing (retention baking) for the memory test, and a ratiobecomes 4.0 significantly above Reference 1 when the organic reactionlayer is absent. That is, FIG. 13 illustrates that it is possible toform the Au plating even after the heat processing for the memory testas long as the organic reaction layer is formed on a metal surface.

Although the description is given regarding a case in which the Auplating is not performed on the surface of the bump land 2 ac in thepresent embodiment as described above, the Au plating may be formed ifthe cost is not considered.

The probe test and programming illustrated in FIG. 11 are performedafter the above-described polyimide layer patterning. In this probe test(first probe test), a probe needle 4 is brought into contact with thefirst pad electrode 2 aa to perform an electrical test, and data isprogrammed in the non-volatile memory (memory cell 2 v). Specifically,the organic reaction layer 2 ka and the first cap film 2 r on thesurface of the first pad electrode 2 aa are pierced through by the probeneedle 4 so that the probe needle 4 is brought into contact with the Alpad 2 s, and the probe test (the first probe test and the programming ofdata in the non-volatile memory) is performed in this state.

In this manner, the first pad electrode 2 aa, which is different fromthe second pad electrode 2 ab, is formed to be exposed to the outsideother than the second pad electrode 2 ab for the connection of therearrangement wiring 2 e in the assembly of the semiconductor deviceaccording to the present embodiment, and thus, it is possible to performthe probe test by bringing the probe needle 4 into contact with thefirst pad electrode 2 aa.

Baking at 250° C. for 12 h illustrated in FIG. 11 is performed after theabove-described probe test and programming. That is, heat processing isperformed with respect to the semiconductor wafer 1. This heatprocessing is a baking test (thermal load test) of the non-volatilememory (flash memory) formed in the semiconductor chip 2, and is alsocalled a retention baking test, in which, for example, the semiconductorwafer 1 is heated at 250° C. for 12 hours (there also is a testperformed for 72 hours when the test time is long). In this case, thetemperature of 250° C. of the heat processing described above is higherthan a melting point of the solder bump 3 (for example, 230° C. in thecase of a lead-free solder).

Accordingly, the solder bump 3 is melted when the retention baking testof the non-volatile memory is performed after mounting the solder bump3, and thus, it is necessary to perform the retention baking test beforemounting the solder bump 3.

In addition, the heating is performed at 250° C. for a long period oftime in the retention baking test, and thus, there is a risk that anoxide film is formed on the surface of the rearrangement wiring 2 e ofthe bump land 2 ac, but the oxidation of the Ni layer 2 n does notproceed since the organic reaction layer 2 kb is formed on the surfaceof the rearrangement wiring 2 e of the bump land 2 ac. That is, it ispossible to prevent the oxidation of Ni in the bump land 2 ac caused bythe high-temperature baking (retention baking) (it is possible toprotect the Ni layer 2 n of the rearrangement wiring 2 e using theorganic reaction layer 2 kb).

The probe test and a retention test illustrated in FIG. 11 are performedafter the above-described baking at 250° C. for 12 hours. In this probetest, the probe needle 4 is brought into contact with the first padelectrode 2 aa to perform a second probe test. The above-describedsecond probe test tests, after the high-temperature baking of thenon-volatile memory (memory cell 2 v), whether the programmed data ofthe memory is lost or whether data failure occurs, for example.

Incidentally, the first pad electrode 2 aa, different from the secondpad electrode 2 ab to which the rearrangement wiring 2 e is connected,is formed to be exposed to the outside also in this second probe test.Thus, it is possible to perform the second probe test by bringing theprobe needle 4 into contact with the first pad electrode 2 aa, similarlyto the first probe test.

Ashing illustrated in FIG. 12 is performed after the above-describedprobe test and retention test. In this step, the organic reaction layer2 kb formed on the surface of the rearrangement wiring 2 e of the bumpland 2 ac is removed by the ashing, and accordingly, the Ni layer 2 n ofthe bump land 2 ac is exposed. Incidentally, the Au plating may beformed on the surface of the bump land 2 ac in order to improve thewettability of the solder bump 3.

Bump formation illustrated in FIG. 12 is performed after theabove-described ashing. In this bump formation, the solder bump 3 ismounted on the bump land 2 ac which is exposed through the fourthopening 2 mb of the rearrangement wiring 2 e. At this time, the bump ismounted using a flux to activate the Ni layer 2 n, and thereafter,reflow is performed to heat the solder bump 3, thereby melting thesolder bump 3. As a result, the solder bump 3 and the Ni layer 2 n ofthe bump land 2 ac are connected to each other.

In the above-described manner, the bump formation is completed.Accordingly, the Al pad 2 s and the solder bump 3 of the semiconductorchip 2 are electrically connected via the rearrangement wiring 2 e.

An appearance and shear test illustrated in FIG. 12 is performed afterthe above-described bump formation. In this step, an appearance test ofthe semiconductor wafer 1 is performed, and connection strength of thesolder bump 3 is tested using a shear stress.

The respective semiconductor chips 2 are cut out for singulation bydicing into pieces from the semiconductor wafer 1 after theabove-described appearance and shear test, and the assembly of the waferprocess package 5 illustrated in FIG. 1 is completed.

Here, the wafer process package 5 according to the present embodimenthas the structure in which the non-volatile memory is formed in thesemiconductor chip 2. In the probe test of the semiconductor substratein which the non-volatile memory is formed in the above-describedmanner, a memory retention test of the non-volatile memory is sometimesrequired, but it is not possible to perform the test after mounting thebump since the test is performed at the temperature of 250° C. for 8hours, for example, and such a temperature is higher than 230° C., whichis the melting point of the lead-free solder bump. In addition, evenwhen the test is performed before forming the rewiring, a maximumtemperature in the rewiring process is 350° C., and thus if any memoryloss occurs, that is meaningless. It is necessary to provide the waferprocess package that allows the memory to be performed before mountingthe bump after forming the rewiring on the basis of such backgrounds.

Further, the memory test is performed by bringing the probe needle 4into contact with the pad of the rearrangement wiring 2 e in theabove-described memory test. The accuracy of the test decreases sincethe Ni layer 2 n formed on the surface of the Cu layer 2 i of therearrangement wiring 2 e has a large contact resistance. At this time,it is considered to perform the Au plating on the pad of therearrangement wiring 2 e in order to achieve a countermeasure againstthe contact resistance of the probe needle 4 and to secure thewettability of the solder bump 3, which causes Ni to spring up and beoxidized on the Au-plated film due to the retention baking, and as aresult, leads to an increase of the contact resistance of the probeneedle 4 and poor wettability and defective bonding of the solder.

In addition, it is also considered to perform the Au plating formationon the pad of the rearrangement wiring 2 e again after the retentionbaking as a countermeasure against the spring-up of Ni on the Au platedfilm, but in this case, cost increases because the Au plating is formedtwice.

Thus, in the method of manufacturing the semiconductor device accordingto the present embodiment, the Al pad equipped with a metal cap as wellas the rewiring structure is newly added to the semiconductor chip 2which requires to be tested at high temperature that exceeds the meltingpoint of the solder such as the memory retention test for a long periodof time. Specifically, each of the first pad electrode 2 aa for the testand the second pad electrode 2 ab for the lead-out of the rearrangementwiring (rewiring) 2 e is provided on the main surface 2 b of thesemiconductor chip 2. For example, the first pad electrode 2 aa, whichis close to the chip end portion as illustrated in FIG. 4, is providedfor the probe test, and the second pad electrode 2 ab for therearrangement wiring 2 e is provided at the inner side than the firstpad electrode 2 aa.

At this time, the first cap film 2 r and the second cap film 2 t arelinked to be integrally famed on the Al pad 2 s of each of the first padelectrode 2 aa and the second pad electrode 2 ab, and the sizes of therespective openings of the electrodes are adjusted for the probe testand for the rearrangement wiring 2 e to be different from each other(the size of the opening for the probe test>the size of the opening forthe rearrangement wiring 2 e). In addition, the Al pad 2 s of the ffirst pad electrode 2 aa and the second pad electrode 2 ab is covered bya metal cap film (first cap film 2 r and the second cap film 2 t). Thus,the Al pad 2 s is protected by the metal cap film (metal film) even whenthe test such as the retention baking is performed at high temperaturefor a long period of time.

Meanwhile, the bump land 2 ac provided in the rearrangement wiring 2 e(rewiring) is covered by the organic reaction layer 2 kb which isextremely thin. Accordingly, it is possible to prevent the bump land 2ac from being oxidized or corroded during the heat processing such asthe retention baking.

Incidentally, the thin organic reaction layer 2 ka is left on the firstcap film 2 r of the first pad electrode 2 aa provided for the probe testby not performing the ashing to process organic residues after formingthe opening in the polyimide layer 2 f at the upper layer. As a result,it is possible to protect the Al pad 2 s in the process of forming therearrangement wiring 2 e.

As described above, it is possible to obtain both a desired heatresistance and the wettability and bonding property of the solder, andto perform the memory retention test at the high temperature exceedingthe melting point of the solder bump 3 for the long period of timebefore forming the bump, according to the process and the structure ofthe present embodiment.

Incidentally, since it is unnecessary to perform the Au plating on thebump land 2 ac in the method of manufacturing the semiconductor deviceaccording to the present embodiment, it is possible to suppress the costincrease in the test. Accordingly, it is possible to achieve thestabilization of the test and to enhance the reliability of the testwhile suppressing the cost increase and the defective bonding of thesolder in the test of the semiconductor device (semiconductor chip 2).

In addition, when the test such as the retention baking is performedusing the first pad electrode 2 aa provided at the end portion of themain surface 2 b of the semiconductor chip 2, a cantilever is used, andthus, the probe needle 4 is brought into contact by penetrating the thinorganic reaction layer 2 ka and the first cap film 2 r. Accordingly,failure of conduction in the test is not caused.

In addition, the solder bump 3 is mounted to the bump land 2 ac of therearrangement wiring 2 e to which the solder bump 3 is mounted afterperforming the ashing to remove the organic reaction layer 2 kb and toexpose the Ni layer 2 n of the bump land 2 ac. Thus, it is possible tomount the bump without inhibiting the alloying reaction with respect tothe solder bump 3.

In addition, since the bump land 2 ac is formed by leading out therearrangement wiring 2 e from the second pad electrode 2 ab, it ispossible to correspond to a decrease in pitch of the bump land 2 ac.

In addition, the first pad electrode 2 aa for the test (probe test) andthe bump land 2 ac for the bump mounting are divided, and thus, the bumpmounting is performed after the high-temperature storage test such asthe retention baking, the quality of the bump mounting is not degraded.Further, it is possible to perform the test using the first padelectrode 2 aa for the test even after mounting the bump in the waferprocess package 5 according to the present embodiment.

Modification Example

FIG. 14 is an enlarged partial plan view illustrating a structure of amodification example of the embodiment, FIG. 15 is a partialcross-sectional view illustrating a structure taken along a line A-Aillustrated in FIG. 14, and FIG. 16 is a cross-sectional viewillustrating a structure of a semiconductor device to which themodification example of the embodiment is applied.

The modification example has structure in which the semiconductor chip 2according to the embodiment described above is incorporated in a systemin package (SIP) 6 illustrated in FIG. 16, and chips are electricallyconnected to each other using a wire 8.

That is, the semiconductor device has the structure in which the wire(metal wire) 8 is connected to the first pad electrode 2 aa for theprobe test illustrated in FIG. 14, and the neighboring semiconductorchips 2 are connected using via wire as illustrated in FIG. 16.

That is, the wire 8 such as the metal wire is connected to the first padelectrode 2 aa for the test (probe test), which is arranged near an endportion (outer peripheral portion) of the semiconductor chip 2 asillustrated in FIG. 15. When the first pad electrode 2 aa is used forthe pad for the wire bonding, it is possible to apply the semiconductordevice to the SIP 6 which is a chip on chip (COC) as illustrated in FIG.16.

The SIP 6 illustrated in FIG. 16 is configured such that smallsemiconductor chips 7 are mounted on each of the plurality ofsemiconductor chips 2, which are mounted on a package substrate 9, viathe plurality of solder bumps 3 using flip-chip connection.Specifically, the plurality of semiconductor chips 2 are mounted on thepackage substrate 9 such that the respective back surfaces 2 c thereofoppose the package substrate 9 using face-up mounting, and further, thesmall semiconductor chips 7 are flip-chip connected with each other viathe plurality of solder bumps 3 on the semiconductor chip 2,respectively.

Further, the neighboring semiconductor chips 2 are electricallyconnected via the wire 8 using a difference in planar size between thesemiconductor chip 2 and the semiconductor chip 7. Further, therespective semiconductor chips 2 and the plurality of wires 8 areresin-sealed by a sealing body 11 made of resin. In addition, aplurality of ball electrodes 10 are provided on a lower surface of thepackage substrate 9 as external terminals. That is, the SIP 6illustrated in FIG. 16 is the semiconductor device of a type in whichthe flip-chip mounting and the wire bonding mounting are mixed.

In the SIP 6, the semiconductor chip 7 on an upper stage side is, forexample, a memory chip, and the semiconductor chip 2 on a lower stageside is, for example, a control chip that controls the semiconductorchip 7.

In the above-described SIP 6, the first pad electrode 2 aa and thesecond pad electrode 2 ab are formed to the semiconductor chip 2, thefirst pad electrode 2 aa is used for the wire connection, and the secondpad electrode 2 ab is used for the lead-out of the rearrangement wiring2 e as illustrated in FIGS. 14 and 15. Further, the bump land lac formedat the rearrangement wiring 2 e is used as the flip-chip connection ofthe semiconductor chip 7 on the upper stage side, and the semiconductorchip 2 on the lower stage side and the semiconductor chip 7 on the upperstage side are electrically connected via the plurality of solder bumps3.

It is possible to apply the semiconductor chip 2 according to thepresent embodiment to the COC structure and the SIP structure by formingthe first pad electrode 2 aa and the second pad electrode 2 ab in thesemiconductor chip 2 as described above.

In the foregoing, the invention made by the inventor has beenspecifically described based on the embodiments. However, it is needlessto say that the present invention is not limited to the foregoingembodiments and various modifications can be made within the gist of thepresent invention.

The description has been given regarding a case in which thesemiconductor device is the wafer process package in the above-describedembodiment, but the above-described semiconductor device may be anothersemiconductor package as long as including the rearrangement wiring andthe semiconductor chip 2 which is provided with the second pad electrode2 ab to which the rearrangement wiring is connected, and the first padelectrode 2 aa different from the second pad electrode 2 ab.

In addition, the description has been given regarding a case in whichthe first pad electrode 2 aa and the second pad electrode 2 ab areprovided on the single integrally-formed Al pad 2 s in theabove-described embodiment, but the first pad electrode 2 aa and thesecond pad electrode 2 ab may be pads in a structure of being formed onthe different Al pads 2 s, and are connected via an internal wiring.

Further, within the gist of the technical idea described above in theembodiment, one or more combination modification examples can be used.

What is claimed is:
 1. A method of manufacturing a semiconductor devicecomprising: (a) forming a pad over a semiconductor substrate; (b)forming a first insulating film over the semiconductor substrate, thefirst insulating film having a first opening exposing a first region ofthe pad and a second opening exposing a second region of the paddifferent from the first region; (c) forming a metal film connected tothe pad in the second opening, while covering the first opening with amask layer; (d) forming a second insulating film over the firstinsulating film so as to expose a part of the metal film; and (e)disposing a conductive material on the part of the metal film exposed bythe second insulating film, wherein the step (d) comprises: (d1) formingthe second insulating film over the first insulating film, (d2) afterthe (d1), performing a probe test by using a probe needle, and (d3)after the (d2), removing an organic reaction layer derived from thesecond insulating film remained on the part of the metal film.
 2. Themethod of manufacturing a semiconductor device according to claim 1,wherein, in the step (d3), the organic reaction layer is removed byashing.
 3. The method of manufacturing a semiconductor device accordingto claim 1, wherein, before the step (d3), a thickness of the organicreaction layer derived from the second insulating film remained on thepart of the metal film is about 100 nm.
 4. The method of manufacturing asemiconductor device according to claim 1, wherein the step (d) furthercomprises step (d4) performing heat processing, after performing thestep (d2) and before performing the step (d3), and wherein a temperatureof the heat processing is greater than a melting point of the conductivematerial.
 5. The method of manufacturing a semiconductor deviceaccording to claim 1, wherein the pad has a rectangular planar shape. 6.The method of manufacturing a semiconductor device according to claim 1,wherein the second insulating film is comprised of polyimide.
 7. Themethod of manufacturing a semiconductor device according to claim 1,wherein a size of the first opening is larger than a size of the secondopening in plan view.
 8. The method of manufacturing a semiconductordevice according to claim 1, wherein the metal film is comprised of a Culayer and a Ni layer formed on the Cu layer.
 9. The method ofmanufacturing a semiconductor device according to claim 1, wherein thepad is an Al pad.
 10. The method of manufacturing a semiconductor deviceaccording to claim 1, wherein the second insulating film has a fourthopening communicating with the first opening.
 11. The method ofmanufacturing a semiconductor device according to claim 1, wherein thesecond insulating film has a third opening communicating with the secondopening.
 12. The method of manufacturing a semiconductor deviceaccording to claim 1, wherein the conductive material is a bump.